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71	Page 1 of 79 RELIABILITY AND FAILURE ANALYSIS Technical adaptation under Directive[removed]EC (RoHS) Investigation of exemptions Add to Reading List Source URL: ec.europa.eu Language: English - Date: 2014-07-28 08:17:06 Chemical elements Poor metals Post-transition metals Electronics manufacturing Restriction of Hazardous Substances Directive Waste legislation Solder Bismuth Flip chip Chemistry Matter Periodic table
72	jV Contents List of Contributors XVII 1 1.1 Add to Reading List Source URL: www.wiley-vch.de Language: English - Date: 2014-03-31 21:03:41 Technology Three-dimensional integrated circuit Wafer Deep reactive-ion etching Etching Flip chip Integrated circuit Isotropic etching EV Group Semiconductor device fabrication Microtechnology Materials science
73	Die Carrier Temporary Reusable Packages S e t t i n g t h e S t a n d a r d s f o r To m o r r ow Die Level Burn-in and Test Add to Reading List Source URL: www.aehr.com Language: English - Date: 2009-03-18 18:13:31 Semiconductor device fabrication Electronics manufacturing Electronic design Electrical engineering Printed circuit board Reliability Flip chip Chip scale package Electronic engineering Electronics Electromagnetism
74	DDf Innova Direct Die Feeder Wafer Feeding The DDf Innova perfects die feeding. Single wafers, are vertically loaded into the feeder, positioned automatically, then precisely located by a vision system. Add to Reading List Source URL: www.assembleon.com Language: English - Date: 2013-01-10 03:02:59 Flip chip Technology Microelectromechanical systems Wafer Semiconductor device fabrication Materials science Electromagnetism
75	Final Program[removed]JWS.xlsx[removed]Session ID / Paper Add to Reading List Source URL: www.imapsne.org Language: English - Date: 2014-04-13 22:38:42 Microtechnology Microelectromechanical systems Wire bonding Integrated circuit Flip chip Analog Devices Copper Materials science Semiconductor device fabrication Technology
76	Simulation Cuts IC Cost 20% by Comparing Flip Chip/Wirebond Thermal Performance Add to Reading List Source URL: s3.mentor.com Language: English - Date: 2013-06-21 14:24:23 Electronics Mechanical engineering Electronic design automation Heat sink Simulation software Thermal management of electronic devices and systems Flip chip Integrated circuit Thermal copper pillar bump Electronic engineering Passive fire protection Heat transfer
77	Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages Add to Reading List Source URL: www.xilinx.com Language: English - Date: 2013-03-04 05:56:59 Manufacturing Reflow soldering Surface-mount technology Rework Solder Thermal profiling Printed circuit board Flip chip Desoldering Electronics manufacturing Electronics Electronic engineering
78	Semtech’s Backward Compatibility Statement September 15, 2009 Semtech’s Backward Compatibility Statement • Add to Reading List Source URL: www.semtech.com Language: English - Date: 2009-09-21 20:50:22 Electromagnetism Solder Surface-mount technology Reflow soldering Printed circuit board Restriction of Hazardous Substances Directive Flip chip Semtech Thermal profiling Electronics manufacturing Electronics Electronic engineering
79	PCB Layout Recommendations for BGA Packages October 2005 Add to Reading List Source URL: www.latticesemi.com Language: English - Date: 2005-11-01 02:00:00 Electromagnetism Ball grid array Printed circuit board NSMD Solder Quad Flat Package Flip chip Through-hole technology PCB Electronics manufacturing Electronic engineering Electronics
80	www.hermes-ect.net no[removed]Nov. 2009 Add to Reading List Source URL: www.ats.net Language: English - Date: 2013-07-29 07:00:36 Electronics manufacturing Printed circuit board Electronics Integrated circuit Flip chip Technology Electromagnetism Electrical engineering Electronic engineering